The Features of the Multi-function Pick and Place Machine

The multi-function pick and place machine is also called a high-precision pick and place machine or a general-purpose machine. It can pick and place high-precision large and special-shaped components, and generally can also pick and place small chip components. It can cover almost all components, so it is called multi-function pick and place machine.

Today, let's talk about the basic features of the multi-function pick and place machine:

1. Most multi-function pick and place machines adopt the arch structure, which has the characteristics of high precision and good flexibility.

2. Most of the multi-function pick and place machines are driven by fully closed-loop servo motors in the X and Y positioning systems, and use linear grating encoders for direct position feedback to avoid errors due to screw distortion.

Some use double motors and double screw rods on both sides of the platform in the y-axis, and use double linear grating scales for feedback, which can effectively reduce the waiting caused by the static placement of the pick and place head, and reduce the error cause by the asynchronous deformation of the beam.

There are more advanced linear magnetic levitation motors. In addition to the technical characteristics of various double drives, they also have the characteristics of direct drive, less wear and tear of mechanical structure, fast feedback, quietness, easy maintenance and high precision.

3. Most of the multi-kinetic pick and place machines adopt the circuit board fixed type, and use the movement of the pick and place head to achieve X and Y positioning. Large or heavy components will not be displaced due to inertia due to the movement of the table.

4. The multi-function pick and place machine can accept all material packaging methods, such as tape and reel packaging, tube packaging, and box and reel packaging. In addition, when there are many materials in the tray, a multi-layer special tray feeder can be installed.

5. In addition to the traditional vacuum suction nozzle, the multi-function pick and place machine can use special suction nozzles for the components that are difficult to pick up. In addition, pneumatic clamping jaw can be used for components that cannot be suctioned by vacuum suction nozzles.

6. When the components of the multi-function pick and place machine are calibrated, the top-view camera is generally used, which has the functions of front light, side light, backlight and online light, and can identify various components. If the size of the component is too large and exceeds one field of view (FOV) of the camera, the top-view camera can also analyze and correct it comprehensively by taking multiple optical images. The pick and place head of some multi-function pick and place machines is also equipped with a moving camera, which can identify various smaller components.

7. In some products, some perforated plug-in components also need to be pick and placed at the same time as other components of pick and place machine, and are reflowed through reflow soldering. The insertion of such perforated plug-in components requires the machine to have an ability of picking and placing under high pressure. The pick and place head of some multi-function pick and place machines has the capability of picking and placing under high pressure, and the pressure can be controlled by the program, and the maximum can reach 5 kg.

8. Some multi-function pick and place machines can be equipped with a soldering flux dip system, which can perform component stack packaging and placement of flip chip.

9. Some multi-function pick and place machines can also be equipped with a dispensing head for dispensing, tin filling or underfilling of some components before picking and placing.

The multi-function pick and place machine can handle a variety of complex components and is an indispensable equipment in the production of complex electronic products. In some scientific research, testing and trial production units, only one or more multi-function pick and place machines are used for small batch production under the condition that they can accommodate the types of materials.

However, the speed of the multi-function pick and place machine when processing small chip components is far lower than that of the high-speed pick and place machine. When picking and placing small chip components, some high-speed pick and place machines can be 5 to 10 times quicker than multi-function pick and place machine. Therefore, in medium and large-scale production, reasonable configuration is generally carried out according to the characteristics of the product, so that the efficiency of each equipment is close to the highest.

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