Hang Zhou Tronstol technology Co., Ltd.
Hang Zhou Tronstol technology Co., Ltd.

As SMT chip processing and inspection personnel, we must master SMT chip processing operations to achieve safe production, high-efficiency production. They can protect personal and property safety, extend the service life of the machine and enable normal and stable operation of daily life production and operation. It is an important embodiment of safe production and efficient production.

Ⅰ. SMT mounter chip processing operations include the following parts.

1. Before starting to operate the SMT mounter, you must wear work clothes, a work cap and a static ring.

2. At the end of the day, you need to organize the desktop hygiene, keep the desktop neat and tidy and turn off the SMT mounter power.

3. In the patch test, it is important to be careful to prevent the measurement of the wrong program and re-serial number.

4. The boards to be tested, to be repaired and has been tested should be clearly distinguished. You should try to avoid mixing boards.

5. Testers in the packing need to do a good job in each box mark, such as model, quantity, etc., so as to facilitate the statistics of the number of each board and prevent the posting of the wrong label.

Ⅱ. The advantages of SMT mounter processing after the specific performance in the following points.

1. Small size of electronic products

The volume of the SMD components is only about 1/10 of the traditional cartridge components. After processing, the volume of general SMT mounters will be reduced by 40% to 60%.

2. High efficiency and low cost

SMT mounter processing is easy to achieve automation, improve production efficiency, save materials, energy, equipment, manpower, time, etc. and reduce costs up to 30% ~ 50%.

3. Light weight

SMT mounter components are also only 10% of the weight of traditional cartridge components. Generally, after the use of SMT, weight reduction is of 60% ~ 80%.

4. High reliability and high vibration resistance.

5. Good high frequency characteristics, reducing electromagnetic and radio frequency interference.

6. Low defect rate of solder joints.

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