With the rapid development of component packaging, more and more RC components have been widely used, and surface mount technology has also developed rapidly. In its production process, the influence and effect of the solder paste printing process on the entire production process is is increasingly valued by engineers. Companies in the industry also widely agree to obtain good soldering, long-term reliable products in quality, and the first thing to pay attention to is the printing of solder paste. In production, it is not only necessary to master and use solder paste printing technology, but also to analyze the causes of problems, and apply improvement measures to production practice.
1. Solder paste
Solder paste is much more complicated than pure tin-lead alloy, and its main components are as follows: solder alloy particles, flux, rheology modifier, viscosity control agent, solvent, etc. We need to choose different types of solder paste; at the same time, choose a large manufacturer with perfect product process technology and stable quality. Generally, the following factors should be paid attention to when choosing solder paste:
(1) Viscosity of solder paste
(2) Tackiness of solder paste
(3) Uniformity and size of solder paste particles
(4) Metal content of solder paste
2. Template factor
(1) The material and engraving of the stencil
(2) The relationship between each part of the stencil and solder paste printing
Dimensions of the opening
The thickness of the stencil
The direction and size of the screen hole
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