Tronstol A1 uses the architecture model which is highly modular in functional logic, power supply, and control logic. That ensure the positioning of production and after-sales problems can be as far as possible Converges to specific modules. It can greatly reduce the coupling between system modules to improve the stability and safety of the system.
The design of board separation is used in the architecture of the internal circuit. A specific functional logic is carried by a separate board. The entire system mainly includes a motherboard card, a drive board, a power supply board, and a gas circuit board. The specific functions are also shared by many small module cards. In practice, it is only necessary to replace a few small cards to quickly troubleshoot problems. Generally, there is no need to plug and unplug the connection. We also use uniformly on the connection line and the patch line High-strength connectors are widely used in the industry for design. The wiring harnesses and connectors have fool-proof designs to ensure resistance to recklessness during installation and maintenance.
The independent power supplies and protection circuits are used in the drive and supply of power. Even if an accident occurs in a module during the movement, the safety of the electronic hardware of other modules can be guaranteed.It will not occur the vicious phenomenon of continuous burning caused by one module. When the machine is abnormal or the line is faulty, we advocate opening the machine repair cover and the placement head cover for live operation to more quickly troubleshoot problems. These methods of dynamic troubleshooting during power-on are often very Efficient, but because the protection function of the electronic circuit of most other equipment and the anti-recklessness of the software logic are not sufficiently designed.Many manufacturers do not recommend this kind of rough live removal method, but the A1's own the superiority of the hardware and software architecture can allow it to perform this efficient detection method.
The entire device adopts a distributed bus architecture, and industrial-grade bus connections are used among as many as 70 to 80 sub-devices. The electronic wiring harness is greatly reduced while ensuring low-latency communication. The streamlining of the wiring harness is the stability of the system hardware premise.