There are two ways: paper tape packaging and plastic tape packaging. Paper tape is mainly used for packaging small-size chip resistors and capacitors. Plastic tape is used for packaging various chip leadless components, composite components,odd-form components, SOT, SOP.
Tube package is used for SOP, SOJ, PLCC.
Components will not move during transportation and will not collide with adjacent components when using tray package. Tray package is mainly used for components that require high coplanarity or large size.
4. In bulk
In bulk package is mainly used for chip leadless components, rectangular and cylindrical capacitors, resistors.
(Metal Electrode Leadless Face)
Tape, Tube or Tray
(Plastic Leadless Chip Carrier)
(Ceramic Leadless Chip Carrier)
(Quad Flat-pack Package)
(Ball Grid Array)
(Quad Flat Leadless Package)