Hang Zhou Tronstol technology Co., Ltd.
Hang Zhou Tronstol technology Co., Ltd.


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1. Tape

There are two ways: paper tape packaging and plastic tape packaging. Paper tape is mainly used for packaging small-size chip resistors and capacitors. Plastic tape is used for packaging various chip leadless components, composite components,odd-form components, SOT, SOP.


2. Tube

Tube package is used for SOP, SOJ, PLCC.


3. Tray

Components will not move during transportation and will not collide with adjacent components when using tray package. Tray package is mainly used for components that require high coplanarity or large size.


4. In bulk

In bulk package is mainly used for chip leadless components, rectangular and cylindrical capacitors, resistors.




Components Type

Footprint

Shape

Packing

Chip Transistor

MELF

(Metal Electrode Leadless Face)

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Tape or

in Bulk

SOT23

(Small-outline

Transistor)

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SOT89

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SOT143

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Integrated Circuit

SOP

(Small-outline

Package)

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Tape, Tube or Tray


SOJ

(Small-outline

J-lead Package)

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PLCC

(Plastic Leadless Chip Carrier)

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LCCC

(Ceramic Leadless Chip Carrier)

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QFP

(Quad Flat-pack Package)

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BGA

(Ball Grid Array)

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Flip Chip

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QFN

(Quad Flat Leadless Package)

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jemma.zhang@tronstol.com
86-571-26265158
4th Floor, Building 5, No. 2, Huayi Road, Yuhang Street, Yuhang District, Hangzhou
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Contact info
86-571-26265158
jemma.zhang@tronstol.com
4th Floor, Building 5, No. 2, Huayi Road, Yuhang Street, Yuhang District, Hangzhou