Surface mount technology (SMT) is a new generation of electronic assembly technology. It compresses traditional electronic components into components that are only a few tenths of the volume, thus realizing the high-density and high-density assembly of electronic products. High reliability, miniaturization, low cost, and production automation. The process of assembling these components on the circuit is called the SMT process, and the related assembly equipment is called SMT equipment. At present, advanced electronic products, especially computer and communication electronic products, have generally adopted SMT technology.
The assembly process of SMT and its process flow mainly depend on the type of surface mount component (SMA), the types of components used, and the conditions of SMT assembly equipment. In general, SMA can be divided into three types of single-sided mixed assembly, double-sided mixed assembly, and full-surface assembly, a total of six assembly processes. Different types of SMA have different SMT assembly processes, and the same type of SMA can also have different SMT assembly processes. Choosing an appropriate assembly method according to the specific requirements of the patch processing and assembly products and the conditions of the assembly equipment is the basis for efficient and low-cost assembly and production. It is also the main content of the SMT process design.